19/10/2023 – 1st ITSCDC@University of Applied Science, Mönchengladbach
Promoting technology transfer
The foundation of any digitized processes, production-related and from cradle-to-grave for finished goods, lays in the collection and targeted processing of valuable data: As well yet not only in that regard the Textile and Apparel faculty of University of Applied Science with the International Textile Supply Chain Digitalization Conference (ITSCDC), very first of its kind, arranged a unique setting at their Mönchengladbach/Germany campus – back in September.
Digital sample design applying functional trademarked 3D Haptic coatings with athletic footwear. © Dr. Thomas Schmidt/Huafeng
Networking among stakeholders is trump: (f.l.t.r.) Lydia Schmeink, Hugo Boss; Anke Klesper and Flora Zangue, both Hohenstein Lab.; Ellen Müller, Stoll and University of applied Sciences host, Prof. Dr. Bastian Quattelbaum. © Yvonne Heinen-Foudeh
Comparison of five A-line skirts, size 38 in different fabric types from the library – physical vs. virtual. Digital fabrics identified in the Lectra (Swatchbook) database. © Hogeschool Gent
ITA Model Factory – Smart wrist band. © Martin Braun
“With digital fashion design rapidly evolving, the demand for highly-skilled labor force will decrease”, forecasts Dr Sheilla Odhiambo, Researcher at Hogeschool Gent over her introduction of the Digital Fashion Project. © Yvonne Heinen-Foudeh
Dr. Thomas Schmidt brings his cumulative scientific knowledge in chemistry and material science plus his expertise in applied nanotechnology with Fraunhofer Institute, Siemens AG ad Adidas into his role as Huafeng’s Director of Innovation & Creation since 2014. © Huafeng
Digital sample design applying functional trademarked 3D Haptic coatings with athletic footwear. © Dr. Thomas Schmidt/Huafeng
Digital robot dispensing process for the haptic coating. © Huafeng
“Well-grounded patterns, fabrics and avatars are key pre-requisites for efficient 3D design and simulation processes” – Flora Zangue. © Yvonne Heinen-Foudeh
Hohenstein`s new guidelines include a systematic introduction of all modules for three-dimensional product development. © Hohenstein